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报告导航:研究报告TMT产业电信
2008-2009年全球及中国手机射频行业研究报告
字数:7.6万 页数:190 图表数:130
中文电子版:8000元 中文纸版:4000元 中文(电子+纸)版:8500元
编号:CA064 发布日期:2009-03 附件:下载

  手机射频系统有三个主要零组件,收发器(Transceivers)、功率放大器(Power Amplifier,下简称PA)和天线开关,有时PA包含在前端模块(Front-End-Module,简称FEM)。2G时代的射频系统只占大约1.5美元的成本,3G时代则占大约6-8美元的成本,4G时代则占大约8-10美元的成本,也是手机升级换代成本增加最多的部分。
 
  收发器是手机平台的一部分,通常提供手机基频的厂家都要提供收发器,两者基本上一一对应的关系。诺基亚是个例外,它采用德州仪器的基频,但是却采用意法半导体或英飞凌提供的收发器。不过现在意法半导体在合并了NXP和爱立信移动平台后推出基频的能力大大增强。对那些跃跃欲试的小厂家来说,收发器的行业门槛很高,因为小厂家通常只能提供单一的收发器而不能提供基频。

  PA是手机中最关键的元件,它决定了手机的通话质量、通话时间、待机时间、信号强度。PA从一开始就牢牢掌握在复合半导体厂家的手中,这些厂家最主要的产品就是PA。PA领域主要的厂家有RFMD,Skyworks,Triquint,Anadigics,Avago,Renesas(瑞萨)。瑞萨的PA全部继承自日立半导体时代的产品,瑞萨成立后在PA领域毫无建树,没有推出过新产品,也没有推出适合3G的PA。

  RFMD一直是PA界的老大,不过Skyworks与RFMD的差距越来越小。RFMD过分依赖诺基亚和摩托罗拉,这两个厂家对RFMD PA领域的销售额贡献度超过75%。RFMD过分依赖大客户,缺乏议价能力,最近处于亏损中。实际诺基亚也过分依赖RFMD,90%以上的PA都来自RFMD。Skyworks主要客户是索爱、LG、三星和摩托罗拉,客户分散度高,风险低。其技术实力也非常优秀,全球第一片含有PA的4G FEM就来自Skyworks。

  Triquint在技术和制造能力方面是最优秀的,它同时也是全球最大GaAs代工厂。Triquint擅长供应高集成度的PA,也擅长PA的封装,全球最小footprint的GSM PA,全球第一颗采用FC封装的PA都是Triquint创造的,其主要客户是三星、LG、RIM和苹果。Anadigics和高通是亲密合作伙伴,因此主要开发CDMA和WCDMA领域的PA。在CDMA市场占有率比较高。Anadigics自成立以来一直在扩张,也导致其财务状况不佳,近5年只有1年盈利。Avago脱胎自原惠普仪器及半导体部门的安捷伦。Avago领先其他厂家,最早开发WCDMA领域,虽然前期销售不佳,但是随着WCDMA的普及,其销售额快速提升。

  3G时代RF系统变得更加复杂,有些智能手机使用多达5个PA,一个针对所有的GSM频带,另外3个针对三个3G频带,还有一个是WLAN的PA。未来PA的发展趋势肯定是集成度提高。Skyworks 和Triqunit在这方面最具潜力。4G时代对PA的要求更高,包括更线性的放大倍数,更高的峰谷比率,更高的效率。无论是2G还是3G时代,PA领域一直是复合半导体厂家的天下,传统的硅半导体厂家根本无法染指。2G时代的PA通常是GaAs HBT,在3G时代,有些厂家继续坚持GaAs HBT。有些厂家独辟蹊径,新进厂家则多采用InGaP HBT,须要指出Skyworks已经收购了飞思卡尔的PA部门。Skyworks在2009年推出了全球第一款针对LTE/EUTRAN的FEM,型号为SKY77445,其PADie采用InGaP BiFET工艺。Anadigics有两款针对LTE/EUTRAN的PA,都采用了InGaP 。

6款典型3G时代PA对比
2009031701.gif

  
  天线开关也是一个高门槛领域,虽然其价格远低于PA和收发器,通常要使用LTCC衬底和SiP封装,全球主要由日本厂家供应,有村田、瑞萨和新日本无线。


Mobile phone RF system consists mainly of transceivers, power amplifier (abbreviated as PA thereafter) and antenna switch. PA might be set in the Front-End-Module or FEM. In 2G, the cost of RF system was only about US $1.5, while In 3G, the cost was increased to between US$6.0 and US$8.0, and the cost will further increased to about US$8.0 to US$10.0 in 4G, obviously, FR system had the highest cost growth during the upgrading of mobile phones.

The receiver is a part of the mobile phone platform. Generally the mobile phone baseband vendors also providing the receivers, however, Nokia’s baseband was from Texas Instruments, but its receiver was from ST Microelectronics or Infineon. ST Microelectronics has further enhanced its baseband ability through the consolidation between NXP and Ericsson mobile platform.

PA (Power Amplifier) is the most key component in a mobile phone, which decides the voice quality, connection time, standby time and signal strength. PA has been produced by compound semiconductor manufacturers all along, including RFMD, Skyworks, Triquint, Anadigics, Avago and Renesas. Renesas still relies on the previous products form Hitachi Semiconductor, launched none of any new products.

RFMD has always the NO.1, but the gap between RFMD and Skyworks is shrinking gradually. RFMD relies much on Nokia and Motorola. 75% sales of RFMD are contributed by those two. In the other hand, above 90% PA of Nokia is from RFMD. Skyworks’s main clients are Sony Ericsson, Motorola, LG and Samsung. The world’s first 4G FEM contains PA was from Skyworks.

As the world’s largest GaAs OEM, Triquint is good at high-integration PA, as well as the PA packaging. The GSM PA with the smallest footprint and the world’s first FC packaged PA were both produced by Triquint. The main clients of Triquint are Samsung, LG, RIM and Apple.

Anadigics has a close relationship with Qualcomm, which focus on the PA development for CDMA and WCDMA. Especially has a high market share in CDMA market. Since its establishment, Anadigics has been expanding continuously, but during the past five years, only one year is profitable.

Avago was previously the semiconductor department (Agilent) of HP. Avago was the first one engaged in the WCDMA development. Though its sales did not look good initially, with the increasing popularity of WCDMA, the sales turned to increase rapidly.

In 3G era, RF system becomes more complex. Some smart mobile phones have as many as five PAs, one is for all GSM frequency bands, one is for WLAN and the other three are for three 3G frequency band separately. Considering the high integration is the further development focus for PA, Skyworks and Triqunit have the biggest potential. 4G has much higher requirements to PA such as higher T/PR and higher efficiency. No matter in 2G or 3G, PA sector is always monopolized by compound semiconductor manufacturers; the traditional silicon semiconductors have no chances. PA was usually GaAs HBT in 2G , in 3G, new entrants tend to InGaP HBT, Skyworks had already acquired the PA department of Freescale. In 2009, Skyworks launched the world’s first model FEM (SKY77445) focus on LTE/EUTRAN. Anadigics also has two models of PA for LTE/EUTRAN, both of them adopted InGaP.

Six Typical PA Models in 3G

2009031702.gif

Antenna switch is also has high entry barriers. Although its price is rather lower than PA and receiver, usually requiring SiP packaing and LTCC underlay. Globally, antenna switches are mainly supplied by Japanese vendors such as MURATA, Renesas and New JRC etc.

第一章:全球手机市场及发展趋势
1.1、全球手机市场
1.2、全球手机发展趋势
1.2.1、手机互联网时代即将到来
1.2.2、HSPA大规模应用已经展开

第二章:中国手机市场与产业
2.1、中国手机市场
2.2、中国手机出口现状
2.3、中国智能手机市场

第三章:射频半导体基础知识简介
3.1、射频电路结构
3.2、射频半导体工艺

第四章:全球手机射频市场现状与趋势
4.1、全球手机射频市场规模
4.2、全球手机频段分布预测
4.3、全球手机射频市场主要厂家占有率
4.4、4G时代的手机射频
4.5、4G时代的收发器
4.6、3、4G时代的PA
4.7、WLAN手机

第五章:手机厂家研究
5.1、诺基亚
5.2、摩托罗拉
5.3、三星
5.4、索尼爱立信
5.5、LG
5.6、国产手机厂家平台研究
5.6.1、天语(天宇朗通)
5.6.2、联想
5.6.3、金立

5.7、智能手机射频配置实例
5.7.1、黑莓BOLD
5.7.2、黑莓STORM
5.7.3、HTC TOUCH
5.7.4、索爱XPERIA X1
5.7.5、T-MOBILE T1
5.7.6、MOTO KRAVE ZN4
5.7.7、诺基亚N95
5.7.8、APPLE IPHONE 16GB

第六章、全球手机射频半导体厂家介绍
6.1、SKYWORKS
6.2、意法半导体(ST-ERICSSON)
6.3、Infineon(英飞凌)
6.4、Silicon  lab
6.5、RFMD
6.7、飞思卡尔
6.8、AVAGO
6.9、高通
6.10、ANADIGICS
6.11、TRIQUINT
6.12、Maxim
6.13、Sirific Wireless
6.14、Sequoia Communications
3.15、Tropian
6.16、瑞萨
3.17、SiGe半导体
6.18、络达科技
6.19、六合万通微电子
6.20、天工通讯
6.21、源通科技
6.22、鼎芯半导体
6.23、广晟微电子
6.24、锐迪科微电子


1. Global Mobile Phone Market Developments
1.1 Market Overview
1.2 Market Developments
1.2.1 The Mobile Phone Internet
1.2.2 Extensively Application of HSPA

2. China’s Mobile Phone Market Developments
2.1 Market Overview
2.2 Mobile Phone Export
2.3 Smart Mobile Phone Market

3. Introduction of RF Semiconductors
3.1 RF Circuit Structure
3.2 Techniques

4. Global Mobile Phone RF Market Developments
4.1 Global Market Scale
4.2 Global Frequency Allocation Forecast
4.3 Global Market Share Distribution of Global Handset RF Vendors
4.4 RF in 4G
4.5 Receiver in 4G
4.6 PA in 3G and 4G
4.7 WLAN Mobile Phone

5. Mobile Phone vendors
5.1 Nokia
5.2 Motorola
5.3 Samsung
5.4 Sony Ericsson
5.5 LG
5.6 Platform Research of Chinese Mobile Phone Vendors
5.6.1 K-Touch
5.6.2 Lenovo
5.6.3 Gionee
5.7 RF Configuration of Smart Phones 
5.7.1 BlackBerry BOLD
5.7.2 BlackBerry STORM
5.7.3 HTC TOUCH
5.7.4 Sony Ericsson XPERIA X1
5.7.5 T-MOBILE T1
5.7.6 MOTO KRAVE ZN4
5.7.7 Nokia N95
5.7.8 APPLE IPHONE 16GB

6. Global Mobile Phone RF Semiconductor Vendors
6.1 SKYWORKS
6.2 ST-Ericsson
6.3 INFINEON
6.4 Silicon Lab
6.5 RFMD
6.6 Freescale
6.7AVAGO
6.8 QUALCOMM
6.9 ANADIGICS
6.10 TRIQUINT
6.11 MAXIM
6.12 Sirific Wireless
6.13 Sequoia Communications
6.14 Tropian
6.15 RENESAS
6.16 SiGe Semiconductor
6.17 Airoha Technology Corp.
6.18 Beijing LHWT Microelectronics Inc.
6.19 Epic Communications, Inc. (Epicom)
6.20 Yuantonix, Inc.
6.21 Comlent Technology, Inc. (Comlent)
6.22 Rising Micro-Electronics Co., Ltd. (RME)
6.23 RDA Microelectronics

2007-2012年全球手机出货量与智能手机所占比例统计及预测
2007-2008年每季度全球手机出货量与增速统计
2007-2008年每季度手机出货量地域分布
2007-2008年每季度全球手机出货技术分布
2008年全球主要手机品牌市场占有率
2007年1季度到2008年3季度全球主要智能手机厂家市场占有率
2008年全球主要智能手机厂家市场占有率
手机发展趋势图
1995-2012年手机发展趋势预测
2008-2013年手机通讯协议栈发展趋势
拉美UMTS-HSPA网络分布图
2004-2012年中国手机市场销量与智能手机所占比例统计
2008年中国主要手机厂家市场占有率
2004-2012年中国手机产量统计及预测
1999-2008年中国手机出口量统计
2002-2008年中国手机出口金额统计
2008年中国手机出口地域分布
2008年中国智能手机主要厂家市场占有率
典型无线终端设备射频框架图
典型无线通信设备终端射频元件工艺图
Super-heterodyne结构图
Homodyne结构图
Harley结构图和典型应用图
Weaver结构图
800MHz-100GHz半导体元件工艺分布
2007-2022年手机功率放大器件要求趋势
2003-2010年全球手机射频市场规模统计及预测
2009-2013年全球手机频段分布预测
2009-2013年全球3G手机频段数量分布预测
2008年全球主要手机射频收发器厂家市场占有率(按出货量)
2008年全球主要手机PA厂家市场占有率(按金额)
2008年GSM系统手机PA主要厂家市场占有率
TQM7M4006内部电子显微镜图
2008年CDMA系统手机PA主要厂家市场占有率
2008年WCDMA系统手机PA主要厂家市场占有率
2008-2013年手机通讯协议发展路线图
全球4G频段分布
主要PA厂家技术能力对比
SKY77441内部框架图
2005-2012年移动宽频用户数预测
STLC4560内部框架图
WiLINK4.0构成图
RF5924内部框架图
诺基亚2005年3季度到2008年4季度每季度手机中国地区出货量统计
三星2005年1季度到2008年4季度每季度手机出货量统计
2005年1季度到2008年4季度索尼爱立信出货量与平均销售价格统计
2005年4季度到2008年4季度LG手机每季度出货量(按制式)
天宇朗通组织结构图
金立通信公司结构
金铭电子组织结构
SKYWORKS 2002-2008财年收入与毛利率统计
SKYWORKS 2003-2007财年核心产品收入统计
SKYWORKS 2005-2008财年地域收入结构
SKYWORKS 2007、2008财年客户结构比例
意法半导体2008年收入结构
意法半导体连续2005-2008年收入统计
意法半导体2008年地区收入结构比例
意法半导体组织结构
意法半导体连续2003-2008年 无线领域的收入
ST-ERICSSON手机平台产品分布及路线图
2006财年4季度到2008财年4季度英飞凌通讯部门收入统计
2003-2007财年英飞凌收发器出货量统计
英飞凌RF芯片路线图
PMB6952内部框架图
Silicon Lab 2001-2005年收入与毛利率统计
RFMD 2001财年-2008财年收入与运营利润率统计
2006-2008年飞思卡尔产品收入结构
2004-2008财年安华高科技收入与运营利润统计
2007-2008财年安华高科技产品收入结构
安华高科技无线领域产品
安华高科技手机射频领域主要产品
WS1102内部框架图
ACPM-7881内部框架图
2004-2008年每季度高通MSM芯片出货量统计
高通RF芯片地域分布
ANADIGICS 2003-2008年收入与毛利率统计
ANADIGICS市场与产品简介
ANADIGICS主要客户一览
ANADIGICS 2004年4季度到2007年4季度收入与毛利率统计
2007、2008年ANDAIGICS客户结构比例
TRIQUINT 2001-2008年收入与毛利率统计
2005-2008年TRIQUINT产品下游应用比例结构
2005-2008年TRIQUINT手机产品网络制式结构
2007年砷化镓晶圆代工厂家市场占有率
TRIQUINT手机业务核心竞争力
MAXIM TD-SCDMA射频系统模块图
MAXIM CDMA2000双波段射频方案模块图
MAXIM CDMA2000单波段射频方案模块图
MAXIM WCDMA射频方案模块图
SW2210内部框架图
SW3200内部框架图
SW3210内部框架图
PF08155B每部框架图
RPF09025B内部框架图
R2A60273内部框架图
络达科技手机RF产品发展路线图
络达科技WLAN射频芯片产品发展路线图

2008年全球前十三大品牌厂家出货量统计
2008年中国手机产量前25大厂家产量排行
2008年中国手机出口前23个国家及地区
6款典型3G时代PA对比
HSPA与Mobile WiMAX对比
诺基亚30款典型手机零组件配置清单
摩托罗拉3款手机零组件配置清单
三星20款典型手机零组件配置清单
索爱手机平台一览
LG 17款典型手机零组件配置清单
天语11款典型手机配置清单
联想10款典型手机配置清单
金立5款典型手机配置清单
黑莓STORM零件构成
HTC Touch ProBill of Materials原料清单 (CDMA)
索爱XPERIA X1零组件配置
T-MOBILE T1 原料清单
MOTO KRAVE ZN4零组件配置清单
N95 零组件配置清单
APPLE IPHONE 16GB零件供应清单
SKYWORKS 4个生产基地简介
SKYWORKS 前端模块产品一览
SKYWORKS GSM/GPRS/EDGE手机功率放大器产品一览
SKYWORKS WCDMA/HSDPA功率放大器产品一览
Infineon收发器产品一览
Silicon Lab 收发器产品一览
RFMD 2007年1季度-2008年4季度每季度收入与毛利率统计
2006年1季度到2008年4季度飞思卡尔手机部门收入统计
飞思卡尔手机射频产品一览
AVAGO手机功率放大器产品一览
络达科技产品
六合万通微电子产品
天工通讯产品
源通科技手机无线功率放大器产品

Global Mobile Phone Shipment and Overall Proportion of Smart Phones, 2007-2012e
Global Quarterly Mobile Phone Shipment and Its Growth, 2007-2008
Regional Distribution of Global Mobile Phone Shipment , 2007-2008
Global Market Share Distribution of Major Mobile Phone Vendors, 2008
Global Market Share Distribution of Major Smart Phone Vendors, 1Q 2007-3 Q 2008
Global Market Share Distribution of Major Smart Phone Vendors, 2008
Mobile Phone Development Trend
Mobile Phone Development Forecast, 1995-2012e
Developments of Mobile Phone Communication Protocol Stack, 2008-2013e
UMTS-HSPA Network Distribution in Latin America
Mobile Phone Sales in China and overall Proportion of Smart Phones, 2004-2012e
Mobile Phone Output in China, 2004-2012e
China’s Mobile Phone Export Volume, 1999-2008
China’s Mobile Phone Export Destinations, 2002-2008
Market Share Distribution of Major Smart Phone Vendors in China, 2008
RF Framework of Typical Wireless Terminal Equipments
RF Components of Typical Wireless Telecom Terminal Equipments
Framework of Super-heterodyne
Framework of Homodyne
Framework and Typical Application Diagram of Harley
Framework of Weaver
Global Mobile Phone RF Market Scale, 2003-2010e
Global Mobile Phone Frequency Distributions, 2009-2013e
Global Market Share Distribution of Major Mobile Phone RF Receiver Vendors by Shipment, 2008
Global Market Share Distribution of Major Mobile Phone PA Vendors, 2008
Global Market Share Distribution of Major GSM PA Vendors, 2008
Global Market Share Distribution of Major CDMA PA Vendors, 2008
Global Market Share Distribution of Major WCDMA PA Vendors, 2008
Global 4G Frequency Distributions
Developments of Mobile Phone Power Amplifier, 2007-2022e
Technical Capability of Major PA Vendors in the World
Inner Framework of SKY77441
Mobile Broadband User Qty., 2005-2012e
Inner Framework of STLC4560
Framework of WiLINK4.0
Inner Framework of RF5924
Quarterly Mobile Phone Shipment of Nokia in China, 2005Q3-2008Q4
Quarterly Mobile Phone Shipment of Samsung, 2005Q1-2008Q4
Quarterly Shipment and Average Selling Price of Sony Ericsson, 2005Q1-2008Q4
Quarterly Shipment of LG, 2005Q4-2008Q4
Organizational Structure of K-Touch
Organizational Structure of Gionee
Organizational Structure of JinMing Electronics
Sales Revenue and Gross Profit Margin of SKYWORKS, 2002-2008
Sales Revenues of SKYWORKS from Its Core Products, 2003-2008
Regional Sales Revenues of SKYWORKS, 2005-2008
Clients of SKYWORKS, 2007-2008
Revenue Structure of ST, 2008
Sales Revenue of ST, 2005-2008
Regional Sales Revenue of ST, 2008
Organizational Structure of ST
Revenue of ST from Its Wireless Division, 2003-2008
Quarterly Revenue of Infineon from Its Communication Division, 2006Q4-2008Q4
Transceiver Shipment of Infineon, 2003-2007
RF Chip Road Map of Infineon
Inner Framework of PMB6952
Sale Revenue and Gross Profit Margin of Silicon Lab, 2001-2005
Sales Revenue and Gross Profit Margin of RFMD, 2001-2008
Freescale’s Revenue Structure, 2006-2008
Sales Revenue and Gross Profit Margin of Avago , 2004-2008
Avago’s Revenue Structure, 2006-2008
Wireless Products of Avago
RF Products of Avago
Inner Framework of WS1102
Inner Framework of ACPM-7881
Quarterly MSM Chip Shipment of Qualcomm, 2004-2008
Regional RF Chip Distribution of Qualcomm
Revenue and Gross Profit Margin of ANADIGICS, 2003-2008
Main Clients of ANADIGICS
Revenue and Gross Profit Margin of TRIQUINT, 2001-2008
Inner Framework of SW2210
Inner Framework of SW3200
Inner Framework of SW3210
Inner Framework of PF08155B
Inner Framework of RPF09025B
Inner Framework of R2A60273
Application of TRIQUINT’s Products, 2005-2008
Network Standard of TRIQUINT’s Mobile Phones, 2005-2008
Market Share Distribution of GaAs Wafer OEMs in 2007
Core Competence of TRIQUINT’s Mobile Phone Business
Block Diagram of MAXIM TD-SCDMA RF System
Block Diagram of MAXIM CDMA2000 Dual-band RF Solution
Block Diagram of MAXIM CDMA2000 Single-band RF Solution
Block Diagram of MAXIM WCDMA RF Solution
Airoha’s RF Products Development Roadmap
Airoha WLAN RF Chip Products Development Roadmap
Mobile Phone Shipment of Global Top13 Vendors in 2008
Ranking of China Top 25 Mobile Phone Vendors by Output in 2008
China’s Top 23 Mobile Phone Export Destinations in 2008
Six Typical Models of PA in 3G
Comparison between HSPA and Mobile WiMAX
Configuration List of Nokia’s 30 Typical Mobile Phone Models
Configuration List of Motorola’s 3 Mobile Phones Models
Configuration List of Samsung’s 20 Typical Mobile Phones Models
Sony Ericsson Mobile Platform
Configuration List of LG’s 17 Typical Mobile Phones Models
Configuration List of K-Touch’s 11 Typical Mobile Phones Models
Configuration List of Lenovo’s 10 Typical Mobile Phone Models
Configuration List of Gionee’s 5 Typical Mobile Phones Models
Configuration of Blackberry STORM
HTC Touch ProBill of Materials
Configuration of Sony Ericsson XPERIA X1
Configuration of MOTO KRAVE ZN4
Configuration of T-MOBILE T1
Configuration f N95
Configuration of APPLE IPHONE 16GB
Four Production Bases of SKYWORKS
GSM/GPRS/EDGE Power Amplifier Product List of SKYWORKS
Receiver Product List of Infineon
Receiver Product List of Silicon Lab
RFMD’s Quarterly Revenue and Gross Profit, 1Q2007-4Q2008
Quarterly Revenue of Freescale’s Mobile Phone Department, 1Q2006-4Q2008
RF Product List of Freescale
RF PA Product List of AVAGO
Airoha’s Main Products
Main Products of LHWT Microelectronics
Main Products of Epic Communications
Wireless PA Product List of TALENT
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