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报告导航:研究报告TMT产业电子半导体
2009-2010年全球及中国移动应用处理器行业研究报告
字数:4.1万 页数:245 图表数:180
中文电子版:8500元 中文纸版:4250元 中文(电子+纸)版:9000元
英文电子版:2500美元 英文纸版:2300美元 英文(电子+纸)版:2800美元
编号:ZYW034 发布日期:2010-05 附件:下载

  所谓移动应用处理器是以各种特定应用(如运算,图形处理,3D生成,MPEG-4/H.264解码,全功能上网)为核心,以移动产品为主要应用领域的应用处理器。其内部可以包含移动通讯的Modem。在其应用的产品中可以是居于核心地位的处理器,也可以是辅助处理器。

  按照应用领域的不同,我们将其分为四大类:智能手机、非智能手机、车载信息娱乐系统、其他(MID电子书和智能本)。还可以简单地分为ARM核心和X86核心两大类。应用处理器领域投入巨大,动辄数亿美元的投入,使得应用处理器成为少数公司的游戏,门槛越来越高。

2007-2013年各种应用处理器市场规模预测

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  未来智能手机仍然是移动应用处理器最主要的市场,而非智能手机领域将急剧下滑。韩国三大厂家Mtekvision、Corelogic和Telechips正是致力于非智能手机领域的应用处理器大厂。在2009年他们遭受重创,Mtekvision收入下降了21%,并且出现了第一次亏损。Corelogic下滑了67%,并且出现巨亏, 如果不转型就会破产。Telechips收入下滑了19%,不过该公司产品线广,手机所占比例不高,因此受打击不大。

  瑞萨的SH-Mobile也遭遇重创,SH-Mobile一直不能走出日本,而日本手机市场已经严重饱和,没有发展空间。并且瑞萨一直依靠和DoCoMo合作开发来推广产品,但是第三代SH-Mobile已经推广不利,越来越多的厂家青睐高通QSD8250这样的全集成IC。至于第四代SH-Mobile则前途难料。

  OMAP暂时还可以不用太担心,不过其前途堪忧。OMAP大客户诺基亚在智能手机领域表现不佳,最多维持可以不下跌的局面。OMAP处理器不包含3G Modem,诺基亚也不乐于采用,诺基亚2010年主力机型的CPU是和飞思卡尔联合开发的RAPUYAMA。OMAP沦为第二选择。

  高通的SANPDRAGON则意气风发,几乎所有顶级手机都是采用了SNAPDRAGON的芯片。高通最新的QSD8672性能进一步加强,这将是2011、2012年智能手机的热门芯片。三星依靠苹果这个大客户,稳稳占据 应用处理器第三的位置,虽然苹果IPAD没有采用三星的应用处理器,但IPHONE还是会采用三星的应用处理器。三星最新的S3C6410和S5PV210都是颇具实力的产品。Marvell在2009年大力拓展产品线,推出了近10款新产品,未来值得高度关注,不过在手机领域Marvell只有RIM一个大客户。

  移动应用处理器的市场在2009年得到进一步拓展,智能本(Smartbook)、汽车娱乐信息系统、电子书是最新的三大市场。

  智能本是介于上网本和智能手机之间的产品,使用智能手机等级的处理器及小型的操作系统。Nvidia Tegra与高通Snapdragon这类CPU将会支持智能笔记本的运行。 智能本的定义是具备永远在线的,以网络应用为主要用途的电子设备,屏幕尺寸在5-10英寸之间,以ARM内核的处理器做CPU。与上网本最大的区别是永远在线,采用的不是X86结构的CPU,而是以ARM内核的处理器做CPU。目前来看智能本试图冲击传统上网本市场,但是其运算性能远不及英特尔的N270,而价格相差无几。便携性也不如智能手机,开机启动仍然需要一定时间。苹果的IPAD也是其强大的竞争对手,联想推迟其全球第一款智能本上市就是未来避开IPAD的冲击。
 
  预计智能本会朝小屏幕发展,和上网本拉开市场区分,屏幕可能在6-10英寸之间,最终售价低于200美元。如此一来,智能本会有比较大的市场。乐观预计在2015年达到5000万台的规模,悲观预计2015年可以达到2500万台。预计2010年则有800万的规模。
  
  汽车娱乐信息系统也是移动应用处理器的一个市场,目前导航仪市场已经出现3D导航。汽车娱乐系统也需要处理大多数的像H.264这样的网络媒体视频。这两者都需要强劲的运算性能和3D图形制造能力。英特尔的ATOM已经取得了奔驰和宝马的市场,而Nvidia的Tegra2取得了奥迪的市场,未来大众集团也全线采用Nvidia的Tegra2。
  
  2009 年全球电子书市场较2008 年增长178%,达300万台。2010 年全球电子书市场将达770万台。电子书系统端最主要之芯片为ARM base之应用处理器,主要供应商为 Freescale、Samsung 以及Marvell。TI 于2010 年加入此市场。

  Freescale 因成功成为Kindle 2 以及Kindle DX 两项最畅销电子书之AP  供货商,市场占有率超过70%。Marvell在2009年推出的AMADA 166E则试图扳回一城,而三星以低价开拓市场,TI则只是扩展OMAP3430的适用范围。


The so-called mobile application processor is centered on a variety of particular applications such as algorithm, graphic processing, 3D formation, MPEG-4/H.264 decoding and full-featured internet surfing. As an application processor focused on mobile products, it can be installed inside with a Modem for mobile communication. In its applied products, mobile application processor serves as a core or an assisted processor.

By application fields, it falls into four categories, i.e., smartphone, non-smart phone, IVI (In-vehicle Infotainment) system and others (including MID e-book and Smartbook). Or it also can be simply divided into two major classes-ARM core and X86 core. The fact that application processor sector involves huge investment capital makes it a “game” for only a small number of enterprises.

Market Size of Application Processors, 2007-2013E

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In the future, smart phones will still be the main markets for mobile application processor, while its application in non-smart phone industry will slump. A case in point is the three leading Korean enterprises Mtekvision, Corelogic and Telechips involving in non-smart phone industry, which were without exception hardly hit in 2009. In terms of revenue, Mtekvision saw a decrease by 21%, which marked its first loss; Telechips also saw a drop by 19%, slightly hit thanks to its wide range of product lines; but Corelogic, the worst inflicted firm, suffered from huge losses and would go bankruptcy if it refused to transform.  

As such, SH-Mobile of Renesas got dampened miserably. SH-Mobile failed to go outside Japan. There is no development room for SH-Mobile since Japanese mobile phone market has been excessively saturated. Moreover, Renesas has long been teaming up with DoCoMo to jointly develop and promote its products. However, its third-generation SH-Mobile encountered difficulty in promotion, because fully integrated IC like QSD8250 by Qualcomm has been favored by the growing number of manufacturers. As for the 4th-generation SH-Mobile, it is hard to predict its development in the future.

Concerning OMAP, there is not much to worry about, but it is not optimistic, either, owning that its VIP client Nokia has not performed well yet in smartphone field. 3G Modem is excluded in OMAP processor and it is not preferably employed by Nokia. The CPU of main Nokia models in 2010 is RAPUYAMA jointly developed with Freescale. And OMAP has become the second choice for star types of Nokia mobile phone.        

By contrast, SANPDRAGON from Qualcomm has gained wide acceptance by nearly all leading mobile phone manufacturers. Qualcomm will further enhance the performance of its QSD8672-the hot chip for Smartphone in 2011 and 2012. As for Samsung, it will continue its third place in application processor industry thanks to its big buyer-Apple. The application processors of Samsung have not been adopted by Apple IPAD but will be employed by Apple’s IPHONE. The latest series of Samsung-S3C6410 and S5PV210 are both powerful products. 

When it comes to Marvell, it worked hard to expand product lines in 2009 and rolled out 10 models or so of new products. Therefore, Marvell deserves closer attention in the future. Nevertheless, Marvell has only one big customer-RIM in mobile phone industry.

In 2009, mobile application processor market expanded further, in which the three emerging markets consist of Smartbook, IVI system and e-book.

Smartbook is a kind of product with function between netbook and smartphone, and it renders the smartphone-based CPU and small operating system. The operation of smartbook will be supported by such CPU as Nvidia Tegra and Qualcomm Snapdragon. Smartbook can be defined as an electronic device always online and being centered on network applications; with screen size between 5-10 inches and ARM’s CPU. The biggest difference with netbook is that its always-on-line feature and ARM-core CPU instead of using the CPU with X86 structure. It seems that Smartbook tends to impact traditional netbook market. Yet, its algorithmic performance falls far short of Intel’s N270, but the prices of the two are so close. Other demerits of Smartbook lie in its poor portability and longer start-up time in comparison with Smartphone. In addition, IPAD of Apple is the competitive rival of Smartbook. The reason why Lenovo postponed the launch of its first Smartbook into market is to avoid the strike from IPAD.

It is expected that Smartbook will feature small screen sized between 6-10 inches so as to widen the market difference with netbook, with the final selling price below US$200. Therefore, smartbook will enjoy a relatively big market.  As is estimated, the market scale will reach 50 million sets optimistically or 25 million sets in a conservative way in 2015. It is expected that the market size will be 8 million sets in 2010.   

Another market of mobile application processor is IVI system. At present, 3D navigation made its debut in the navigator market. Similarly, IVI also needs to process network media videos like H.264. So, it requires powerful algorithm performance and 3D graphic processing capacities. As yet, Intel’s ATOM has gained Benz and BMW, and Nvidia’s Tegra2 has occupied Audi. Moreover, Volkswagen Group is expected to employ Nvidia’s Tegra2 to its product portfolio.    

In 2009, the e-book market grew 178% to 3 million sets from a year earlier. In 2010, the global e-book market is expected to realize 7.7 million sets. The core chip of e-book system is the application processor of ARM base, whose suppliers are mainly composed of Freescale, Samsung and Marvell. In 2010, TI set foot in this market.

As the AP supplier of the best-selling e-books of Kindle 2 and Kindle DX, Freescale has boasted of a market share of over 70%. As for Marvell, it tended to turn a new page by launching AMADA 166E in 2009. While Samsung seek market expansion with low-price strategy. And TI widened its application range of OMAP3430.

第一章:移动应用处理器简介
1.1、移动应用处理器定义
1.2、非智能手机用应用处理器

第二章:全球手机市场及发展趋势
2.1、全球手机市场现状
2.2、智能手机市场
2.3、中国手机市场
2.4、中国手机产业
2.5、中国智能手机市场

第三章:智能手机核心软硬件研究
3.1、智能手机处理器发展趋势
3.1.1、Cortex-A9
3.1.2、Cortex A5
3.1.3、Mali 图形处理器(GPU)
3.1.4、Imagination PowerVR
3.2、智能手机处理器现状
3.3、操作系统总结

第四章:上网本
4.1、上网笔记本电脑定义
4.2、上网本发展趋势:内置数据卡
4.3、上网本硬件构成简介
4.4、上网本全球市场规模
4.5、中国上网本市场
4.6、ARM与英特尔的上网本之争

第五章、其他市场
5.1、智能本定义与实例
5.2、智能本设计
5.3、智能本市场
5.4、MID市场前景
5.5、IPAD
5.6、电子书
5.7、电子书之IC
5.8、车载信息娱乐系统

第六章、应用处理器厂家研究
6.1、德州仪器
6.2、瑞萨
6.3、东芝
6.4、AMD/ATI
6.5、NVIDIA
6.6、MTEKVISION
6.7、CORELOGIC
6.8、意法半导体(ST-ERICSSON)
6.9、FREESCALE
6.10、曜鹏
6.11、MARVELL
6.12、三星
6.13、卓然
6.14、RMI
6.15、炬力
6.16、TELECHIPS
6.17、高通(QUALCOMM)


1. Overview of Mobile Application Processor
1.1 Definition
1.2 Non-smartphone Application Processor

2. Global Mobile Phone Market
2.1 Status Quo of Global Mobile Phone Market
2.2 Smart Phone Market
2.3 China Mobile Phone Market
2.4 China Mobile Phone Industry
2.5 China Smart Phone Market

3. Core Hardware & Software of Smart Phone
3.1 Development Trends of Smart Phone Processor
3.1.1 Cortex-A9
3.1.2 Cortex A5
3.1.3 Mali Graphics Processor (GPU)
3.1.4 Imagination PowerVR
3.2 Status Quo of Smart Phone Processor
3.3 Summary of Operating Systems

4. Netbook
4.1 Definition of Netbook
4.2 Development Trend: Embedded Data Card
4.3 Hardware Configuration of Netbook
4.4 Global Netbook Market Scale
4.5 China Netbook Market
4.6 Netbook Competition between ARM and Intel


5. Other Markets
5.1 Definition of Smart Book and Its Samples
5.2 Design of Smart Book
5.3 Smart Book Market
5.4 MID Market Outlook
5.5 IPAD
5.6 E-book
5.7 IC of E-book
5.8 In-vehicle Infotainment Systems

6. Application Processor Vendors
6.1 TI
6.2 Renesas
6.3 Toshiba
6.4 AMD/ATI
6.5 Nvdia
6.6 Mtekvision
6.7 CoreLogic
6.8 STMicroelectronics
6.9 Freescale
6.10 Alpha Imaging Technology (AIT)
6.11Marvell
6.12 Samsung
6.13 Zoran
6.14 RMI
6.15 Actions Semiconductor
6.16 Telechips
6.17 Qualcomm

2007-2013年各种应用处理器市场规模预测
2008年非智能手机应用处理器主要厂家市场占有率统计(按金额)
2007-2013年全球相机手机像素分布
2007-2013年自动对焦相机手机出货量
2007-2012年全球手机出货量
2007年1季度-2009年4季度全球手机出货量
2007年1季度-2009年4季度全球手机出货量地域分布
2007年1季度-2009年4季度全球手机出货量技术分布
2006-2010年全球CDMA/WCDMA手机出货量地域分布
2009年全球主要手机厂家市场占有率
2010年1季度全球主要手机厂家市场占有率
2008-2010年全球智能手机厂家市场占有率
2008年中国主要手机厂家市场占有率
2009年中国主要手机厂家市场占有率
2004-2012年中国手机产量统计及预测
2008、2009年中国智能手机主要厂家市场占有率
目前典型顶级手机内核
ARM内核路线图
Cortex-A9内核
STERICSSON U8500 系统
Cortex A5 内部框架
ARM Mali图形架构一览
采用PowerVR的典型手机一览
各操作系统出货量手机厂家分布
2007-2012年上网本内置数据卡类型预测
英特尔上网本基本构成
上网本成本结构
2007-2013年上网本出货量
2007-2012年上网本用途分布
2008-2012年中国上网本市场统计及预测
2008年主要上网本厂家市场占有率
OMAP 上网本软件系统结构图
英特尔ATOM处理器与OMAP 3处理器PCB板对比
ARM智能本框架图
2008-2012年电子书市场规模
2007-2013年全球汽车信息娱乐系统市场规模统计及预测
2007-2013年全球汽车信息娱乐系统 出货量统计及预测
2006-2010年全球汽车信息娱乐系统 出货量地域分布
2008年全球汽车嵌入式 信息娱乐系统主要厂家市场占有率
2008年全球汽车售后 信息娱乐系统主要厂家市场占有率
2007-2009年德州仪器收入事业分布
2007-2009年德州仪器运营利润事业分布
德州仪器OMAP路线图
OMAP 4系列简介
OMAP44X内部框架图
OMAP44X典型应用图
OMAP44X软件架构图
与OMAP44X配合的TWL6030 电源管理、TWL6040 音频后端处理内部框架图
瑞萨2004-2009财年收入与运营利润率统计及预测
2002-2009年SH-Mobile出货量统计及预测
SH-Mobile路线图
SH-Mobile G2、G3 显微裸晶(Die) 图
SH-Mobile G3内部框架图
SH-Mobile平台结构
SH-Mobile平台硬件结构
SH-Mobile平台中间件路线图
SH-Mobile平台视频中间件路线图
SH-Mobile平台音频中间件路线图
WMA应用中间件示例
数字电视中间件结构示例
SH-Mobile L3V2内部框架图
SH-Mobile UL内部框架图
SH-Mobile 3(SH73180)内部框架图
SH-Mobile 3A(SH73380)内部框架图
SH7722(SH-MobileR)内部框架图
SH7724典型应用图
SH7724 内部框架图
2001-2010财年东芝半导体业务收入与利润统计及预测
东芝2005-2009财年产品收入结构比例预测
东芝半导体2003-2009财年各领域投资统计及预测
东芝手机应用处理器路线图
东芝手机应用处理器内核结构
东芝手机应用处理器内部框架图
东芝手机应用处理器视频流程图
2005-2010财年Nvidia收入与运营利润率
2008-2010财年Nvidia收入地域分布
2008-2010财年Nvidia收入部门分布
2007-2010财年Nvidia消费类电子部门收入与运营利润
Nvidia手机GPU内部框架图
TEGRA内部框架图
2003-2009年Mtekvision收入与运营利润统计
Mtekvision战略
Mtekvision组织结构
Mtekvision人员配置结构
Mtekvision运作流程
Mtekvision全球分布
1999-2008年Mtekvision销售额与产品结构统计及预测
Mtekvision各型号产品截至2007年2季度累积出货量
2008年1-4季度Mtekvision客户比例结构
2008年1-4季度Mtekvision产品比例结构
2009年1-4季度Mtekvision客户比例结构预测
2009年1-4季度Mtekvision产品比例结构预测
MV8720内部框架图
MV8750内部框架图
采用Mtekvision的最新手机一览
2003-2009年CoreLogic收入与运营利润率统计
2003-2008年CoreLogic产品收入结构
CoreLogic产品路线图
CoreLogic产品技术发展
CoreLogic SWOT
CL6100内部框架图
CL9000内部框架图
2007年意法半导体各部门收入结构比例
意法半导体NOMADIK产品路线图
STN8815内部框架图
STN8815特色
STN8815典型应用图
2006-2008年飞思卡尔产品收入结构
IMX系列应用处理器路线图
IMX平台软件结构
Sigamtel被收购后的产品路线图
STMP3710内部框架图
STMP3770内部框架图
STMP3731内部框架图
STMP3738内部框架图
STMP3750内部框架图
IMX31内部框架图
IMX31应用实例
IMX35X系列产品一览
IMX37内部框架图
IMX515 内部框架图
IMX515 智能手机典型应用图
2009年9月-2010年3月曜鹏收入产品分布
曜鹏产品路线图
2004-2010财年Marvell收入与运营利润率统计
PXA910/920 内部框架图
三星应用处理器技术
三星应用处理器路线图
S5PC100 内部框架图
S3C6410内部框架图
S5P6640内部框架图
2004-2009年卓然收入与运营利润率
卓然2001-2009年收入统计
卓然2002-2009年每季度收入统计
卓然2008-2009年 地域收入结构比例
2008-2009年Zoran产品下游收入结构比例
APPROACH 5内部框架图
APPROACH 7内部框架图
AU1200典型应用图
AU1200内部框架图
AU1300系列产品内部框架图
2003-2008年炬力收入与毛利率统计
炬力2007年1季度到2009年4季度收入与毛利率统计
炬力产业链流程
炬力MP3产品路线图
炬力MP4产品路线图
ATJ2257 内部框架图
TELECHIPS全球分布
2001-2007年TELECHIPS收入及产品分布
2005-2010年TELECHIPS收入与运营利润率统计及预测
2009-2010年TELECHIPS每季度产品下游应用比例结构
TELECHIPS音频领域主要客户及使用该公司产品一览
TELECHIPS手机领域主要客户及使用该公司产品一览
TELECHIPS汽车/家用音响领域主要客户及使用该公司产品一览
TELECHIPS产品路线图
TELECHIPS最新产品简介
TCC8900 典型应用图
2009年前9月高通专利授权新客户地域分布
QSD8250 内部框架图

2008年中国手机产量前25大厂家产量排行
Cortex A5性能
常见智能手机CPU参数对比
2008-2010年智能型手机操作系统出货量实绩
2008年3季度全球主要上网本厂家出货量统计
英特尔N270、N280性能全面对比
使用OMAP3430 的手机一览
采用SH-Mobile处理器的手机一览
使用SH-Mobile的产品一览
SH-MobileG1、 G2、G3特性对比
采用东芝应用处理器的手机一览
ATI手机多媒体芯片一览
使用ATI手机GPU的手机一览
使用Nvidia手机GPU的手机一览
Nvidia手机GPU特性对比
CSP系列产品一览
MVP系列产品一览
MMP系列产品一览
采用STN8810/8815 的手机一览
2006年1季度到2010年4季度飞思卡尔手机部门收入统计
飞思卡尔应用处理器产品一览
2007-2009年曜鹏收入与运营利润
曜鹏产品特性对比
曜鹏 MMP产品线产品一览
曜鹏ISP产品线产品一览
曜鹏MAP产品线产品一览
使用曜鹏产品手机的产品一览
Marvell ARMAD系列产品一览
三星移动应用处理器一览
采用S5PC100、S3C6410手机一览
RMI ALCHEMY产品一览
TELECHIPS产品一览

Application Processor Market Scale by Category, 2007-2013E
Market Shares (by Sum) of Non-smartphone Application Processor Vendors, 2008
Pixel Distribution of Camera Phones Worldwide, 2007-2013E
Shipment of Auto Focus Camera Phones, 2007-2013E
Global Mobile Phone Shipment, 2007-2012E
Global Mobile Phone Shipment, 2007Q1-2009Q4
Global Mobile Phone Shipment by Region, 2007Q1-2009Q4
Global Mobile Phone Shipment by Technology, 2007Q1-2009Q4
Global CDMA/WCDMA Mobile Phone Shipment by Region, 2006-2010
Market Shares of World’s Major Mobile Phone Manufacturers, 2009
Market Shares of World’s Major Mobile Phone Manufacturers, 2010Q1
Market Shares of World’s Major Smart Phone Manufacturers, 2008-2010
Market Shares of China’s Major Mobile Phone Manufacturers, 2008
Market Shares of China’s Major Mobile Phone Manufacturers, 2009
China Mobile Phone Output, 2004-2012E
Market Shares of China’s Major Smart Phone Manufacturers, 2008 vs. 2009
Cores of Typical First-Class Mobile Phones Currently
ARM Core Roadmap
Cortex-A9 Core
STERICSSON U8500 System
Block Diagram of Cortex A5
ARM Mali Graphics Framework
Typical Mobile Phones Adopting PowerVR
Shipment Distribution of Manufacturers of Mobile Phone by Operating System
Types of Netbook Embedded Data Card, 2007-2012E
Basic Constitution of Intel Netbook
Cost Structure of Netbook
Netbook Shipment, 2007-2013E
Layout of Netbook Applications, 2007-2012E
China’s Netbook Market, 2008-2012E
Market Shares of Major Netbook Manufacturers, 2008
Software System Structure of OMAP Netbook
PCB Comparison between Intel ATOM Processor and OMAP 3 Processor
Framework of ARM Smart Book
E-book Market Scale, 2008-2012
Global Automotive Infotainment System Market Scale, 2007-2013E
Global Automotive Infotainment System Shipment, 2007-2013E
Global Automotive Infotainment System Shipment by Region, 2006-2010
Market Shares of World’s Major Manufacturers of Automotive Embedded Infotainment System, 2008
Market Shares of World’s Major Manufacturers of Automotive After-Sale Infotainment System, 2008
TI’s Revenue by Business, 2007-2009
TI’s Operating Profit by Business, 2007-2009
TI’s OMAP Roadmap
Introduction to OMAP 4 Series
Block Diagram of OMAP44X
Typical Application of OMAP44X
Software Framework of OMAP44X
Block Diagram of TWL6030 Power Management, TWL 6040 Audio Back-end Processing Supported by OMAP44X
Revenue and Operation Profit Rate of Renesas, FY2004-FY2009
Shipment of SH-Mobile, 2002-2009
SH-Mobile’s Roadmap
SH-Mobile G2, G3 Die
Block Diagram of SH-Mobile G3
Structure of SH-Mobile Platform
Hardware Structure of SH-Mobile Platform
Middleware Roadmap of SH-Mobile Platform
Video Middleware Roadmap of SH-Mobile Platform
Audio Middleware Roadmap of SH-Mobile Platform
Middleware Sample of WMA Application
Middleware Structure of DTV
Block Diagram of SH-Mobile L3V2
Block Diagram of SH-Mobile UL
Block Diagram of SH-Mobile 3 (SH 73180)
Block Diagram of SH-Mobile 3A (SH73380)
Block Diagram of SH7722 (SH-MobileR)
Typical Application of SH7724
Block Diagram of SH7724
Revenue and Profit of Semiconductor Business of Toshiba, FY2001-FY2010
Revenue Structure of Toshiba by Product, FY2005-FY2009
Investment of Toshiba Semiconductor by Sector, FY2003-FY2009
Roadmap of Toshiba Mobile Application Processor
Core Structure of Toshiba Mobile Application Processor
Block Diagram of Toshiba Mobile Application Processor
Video Flow of Toshiba Mobile Application Processor
Revenue and Operating Profit Margin of Nvidia, FY2005-FY2010
Revenue of Nvidia by Region, FY2008-FY2010
Revenue of Nvidia by Division, FY2008-FY2010
Revenue and Operating Profit of Nvidia’s Consumer Electronics Dept., FY2007-FY2010
GPU Block Diagram of Nvidia Mobile Phone
Block Diagram of TEGRA
Revenue and Operating Profit of Mtekvision, 2003-2009
Strategy of Mtekvision
Organization Structure of Mtekvision
Staffing of Mtekvision
Operation Flows of Mtekvision
Global Presence of Mtekvision
Sales and Product Structure of Mtekvision, 1999-2008
Accumulative Shipment of Mtekvision Products by Type, as of 2007 Q2
Client Proportion of Mtekvision, Q1-Q4, 2008
Product Proportion of Mtekvision, Q1-Q4, 2008
Client Proportion of Mtekbision , Q1-Q4,2009E
Product Proportion of Mtekvision, Q1-Q4, 2009E
Block Diagram of MV8720
Block Diagram of MV8750
Latest Mobile Phones Employed with Mtekvision
Revenue and Operation Profit Margin of CoreLogic, 2003-2009
Revenue Structure of CoreLogic by Product, 2003-2008
Product Roadmap of CoreLogic
Technology Development of CoreLogic’s Products
CoreLogic SWOT
Block Diagram of CL6100
Block Diagram of CL9000
Revenue Structure of ST Microelectronics by Division, 2007
NOMADIK Product Roadmap of ST Microelectronics
Block Diagram of STN8815
Features of STN8815
Typical Application of STN8815
Revenue Structure of Freescale by Product, 2006-2008
Roadmap of IMX Series Application Processor
Software Structure of IMX Software Platform
Product Roadmap of Sigamtel after Being Acquired
Block Diagram of STMP3710
Block Diagram of STMP 3770
Block Diagram of STMP 3731
Block Diagram of STMP 3738
Block Diagram of STMP 3750
Block Diagram of IMX31
Application Sample of IMX31
Product List of IMX35X Series
Block Diagram of IMX37
Block Diagram of IMX515
Typical Application of IMX515 Smartphone
Revenue of Alpha Imaging Technology by Product, Sep.2009-Mar.2010
Product Roadmap of Alpha Imaging Technology
Revenue and Operating Profit Margin of Marvell, FY2004-FY2010
Block Diagram of PXA910/920
Application Processor Technology of Samsung
Application Processor Roadmap of Samsung
Block Diagram of S5PC100
Block Diagram of S3C6410
Block Diagram of S5P6640
Revenue and Operation Profit Margin of Zoran, 2004-2009
Revenue of Zoran, 2001-2009
Quarterly Revenue of Zoran, 2002-2009
Revenue Structure of Zoran by Region, 2008-2009
Structure of Zoran Revenue from Downstream Products, 2008-2009
Block Diagram of APPROACH5
Block Diagram of APPROACH7
Typical Application of AU1200
Block Diagram of AU1200
Block Diagram of AU1300 Series Products
Revenue and Gross Profit Margin of Actions, 2003-2008
Revenue and Gross Profit Margin of Actions, 2007 Q1-2009 Q4
Industry Chain Flow of Actions
MP3 Product Roadmap of Actions
MP4 Product Roadmap of Actions
Block Diagram of ATJ2257
Global Presence of TELECHIPS
Revenue and Product Distribution of TELECHIPS, 2001-2007
Revenue and Operation Profit Margin of TELECHIPS, 2005-2010E
Downstream Application Proportions of TELECHIPS by Product, (by Quarter)2009-2010
Main Customers and Products Employed of TELECHIPS’s Audio Sector
Main Customers and Products Employed of TELECHIPS’s Mobile Phone Sector
Main Customers and Products Employed of TELECHIPS’s Auto/Home Audio System Sector
Product Roadmap of TELECHIPS
Introduction of TELECHIPS’s Latest Products
Typical Application of TCC8900
Regional Distribution of New Customers Authorized with Qualcomm Patent, Jan.-Sep. of 2009
Block Diagram of QSD8250

Ranking of China’s Top 25 Mobile Phone Manufacturers by Output, 2008
Performance of CortexA5
CPU Parameters of Popular Smartphone
Shipment Achievement of Smartphone Operation System, 2008-2010
Shipment of Leading Netbook Manufacturers worldwide, 2008 Q3
Performance Contrast of Intel’s N270 and N280 Series
List of Mobile Phones Employing OMAP3430
List of Mobile Phones Employing SH-Mobile CPU
List of Products Employing SH-Mobile
Property Comparison of SH-Mobile G1, G2, G3
List of Mobile Phones Employing Toshiba’s Application Processor
ATI Mobile Phone Muti-Media Chip List
List of Mobile Phones Employing ATI’s GPU
List of Mobile Phones Employing Nvidia’s GPU
GPU Property Comparison of Nvidia
CSP Series Products
MVP Series Products
MMP Series Products
List of Mobile Phones Employing STN8810/8815
Revenue of Freescale’s Mobile Phone Division, 2006 Q1-2010 Q4
Application Processor List of Freescale
Revenue and Operation Profit of Alpha Imaging Technology, 2007-2009
Product Property Comparison of Alpha Imaging Technology
MMP Product Line List of Alpha Imaging Technology
ISP Product Line List of Alpha Imaging Technology
MAP Product Line List of Alpha Imaging Technology
List of Mobile Phones Employing the Products of Alpha Imaging Technology
Product List of Marvell ARMAD Series
Mobile Application Processors of Samsung
List of Mobile Phones Employing S5PC100, S3C6410
Product List of RMI ALCHEMY
Product List of TELECHIPS
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