2011年全球及中国内存行业研究报告 >> 水清木华研究中心

　　2011年，由于标准型DRAM成长乏力，晶圆价格和出货量均下降。而平板电脑和智能手机的兴起，使得Mobile DRAM出货量的年复合增长速度达到175%，今年第一季度Mobile DRAM 已占到全球DRAM总产出的15.6%。

　　手机Flash的年复合增长率超过70%，内嵌式Flash市场占Flash市场的比重将由2010年的四成增长到六成以上。eMMC在移动设备领域大有前途。

　　根据各大DRAM厂内存产品在2011年上半年的营收排名，韩系厂商三星和海力士稳居前两位。

　　三星DRAM技术制程将由3x纳米进入到2x纳米，NAND Flash技术制程由27纳米进入21纳米。2011年第一季度，DRAM、NAND Flash及MCP的销售收入分别占三星内存总收入的54.4%、42.3%及3.3%。受惠于35纳米产出占比大幅上升，第二季度三星内存市场份额超过40%。在Mobile DRAM领域，三星已经量产30纳米制程的低功耗LPDDR2产品。

　　海力士公司DRAM技术制程将由44纳米进入到38纳米，NAND Flash技术制程由26纳米进入20纳米。2011年第一季度，DRAM、NAND Flash及MCP的销售收入分别占海力士内存总收入的71.2%、19.7%及9.1%。海力士目前以50nm制程生产Mobile DRAM，2011第二季开始将新增3 万片的月产能，年底计划将非PC 的DRAM 的比重提高到60%。

　　日系厂商东芝与Sandisk公司共同投资NAND晶圆厂，当前采用19nm制程技术。尔必达2011年量产30纳米制程的DRAM产品。尔必达已将重心从标准型DRAM转向Mobile DRAM，并导入30纳米制程生产后者。Mobile DRAM营收已占尔必达DRAM营收50％以上。

　　美光科技现行制程技术为42纳米，37纳米处于样品测试阶段。2011年第一季度，DRAM、NAND Flash及NOR的销售收入分别占美光科技总收入的47%、31%及19%。Spansion公司于2010年重组后，专注于嵌入式内存领域，2011年Spansion和三星同意交叉授权彼此的专利产品。

　　台系厂商旺宏为全球最大的Mask ROM厂商及第四大NOR Flash 制造商。2011年第一季度，其ROM技术制程以65纳米为主，二季度45纳米将出样品。旺宏NOR Flash技术制程以110纳米为主，二季度75纳米产品将大批量生产。旺宏1Q11 ROM 营收比重占41％、NOR Flash 占51％、Foundry Business Group 占8％。

　　南亚科技2011年内存产量扩产到6 万片，其中3 万片为50/42nm标准型内存，另外3 万片为特殊内存，包含Mobile DRAM 等产品。

　　代工厂商华亚科技提供 DRAM 内存晶圆代工服务，其客户为南亚科技与美光科技。2010年50纳米制程产品产能满载，2011年导入42纳米DRAM产品。
华邦科技2011 年主要成长动力为Nor Flash，其中Serial Nor Flash占其 Flash出货约9成。2011年第一季度，Nor Flash、利基型DRAM及Mobile DRAM分别占华邦科技总收入的 31%、36%及28%。其Mobile DRAM客户主要为Micron 与Spansion。

In 2011, the standard DRAM saw the slowdown in growth. But the mushroom of tablet PC and smart phone enables the CAGR of the Mobile DRAM shipment to soar to 175%. In Q1 2011, the Mobile DRAM accounted for 15.6% of the total output of global DRAM.

The CAGR of mobile flash exceeds 70%, and the embedded Flash market will enjoy a share of 40% in 2010 to over 60% in the Flash market. eMMC has a good prospect in mobile devices.

According to the ranking concerning revenue from memory products of DRAM vendors in H1 2011, South Korea-based Samsung and Hynix ranked the top two.

Samsung will transform its process technology of DRAM from 3x nm to 2x nm, and that of NAND Flash from 27 nm to 21 nm. In Q1 2011, the proceeds from DRAM, NAND Flash and MCP accounted for 54.4%, 42.3% and 3.3% of Samsung's memory revenue respectively. Benefiting from the substantial growth in the output of 35 nm products, Samsung’s memory occupied 40% market shares in Q2. As for Mobile DRAM, Samsung has mass-produced low-power LPDDR2 with 30 nm process.

Hynix will convert DRAM process from 44 nm to 38 nm, and NAND Flash process from 26 nm to 20 nm. In Q1 2011, the sales of DRAM, NAND Flash and MCP made up 71.2%, 19.7% and 9.1% of Hynix’s total revenue from memory products separately. Hynix presently employs the 50nm process to produce Mobile DRAM. Since Q2 2011, Hynix will add monthly capacity of 30,000 pcs and plans to raise the proportion of non-PC DRAM to 60%.

The NAND wafer fab, co-invested by Japanese vendors Toshiba and Sandisk, applies the 19-nm process technology. In 2011, Elpida realized the mass-production of 30-nm process DRAM. Elpida has transferred to focus on Mobile DRAM instead of standard DRAM and introduced 30-nm process for the fabrication of the former. The earnings from Mobile DRAM accounted for more than 50% of Elpida’s revenue.

The current process technology of Micron Technology is 42 nm process and 37-nm process is still in the testing phase. In Q1 2011, the sales of DRAM, NAND Flash and NOR shared 47%, 31% and 19% of Micron’s total revenue respectively. After its reorganization in 2010, Spansion is devoted to embedded memory and agrees to cross license their patented products with Samsung.

Taiwan-based vendor Macronix is the world's largest vendor of Mask ROM and the fourth largest NOR Flash vendor. In Q1 2011, ROM products of Macronix mainly adopted 65-nm process technology, and 45-nm process sample will be introduced in Q2. 110-nm process dominates the production of NOR Flash, and 75-nm process products will be mass-produced in Q2. The revenue of ROM, NOR Flash and Foundry Business Group made up 41%, 51% and 8% of Macronix’s total revenue separately in 1Q 2011.

In 2011, Nanya Technology expanded its output of memory to 60,000 pieces, 30,000 pcs of which are 50/42nm standard memory, and the rest 30,000 ones are special memories like Mobile DRAM.

Inotera provides DRAM wafer foundry services and its customers are Nanya Corporation and Micron Technology. The company reached full capacity of 50-nm process products in 2010 and introduced 42-nm process DRAM products in 2011.

The growth of Winbond is mainly motivated by Nor Flash, of which Serial Nor Flash made up around 90% of Flash shipment. In Q1 2011, the sales of Nor Flash, Specialty DRAM and Mobile DRAM accounted for 31%, 36% and 28% of Winbond’s total revenue respectively. The main customers of Mobile DRAM include Micron and Spansion.

2007-2014年全球手机出货量
2008年1季度-2011年1季度每季度全球手机出货量与年度增幅
2007-2011年每季度CDMA、WCDMA手机出货量
2010年1季度-2011年1季度全球主要手机品牌出货量
2009年1季度-2010年3季度全球主要手机品牌收入市场占有率
2009-2010年全球主要手机品牌出货量
2009年1季度-2010年4季度全球五大手机厂家运营利润率
2010年3季度全球智能手机操作系统出货量
2011年1季度全球主要智能手机厂家市场占有率
2009-2012年智能手机操作系统市场占有率
2010-2011年全球主要手机厂家智能手机出货量
2000-2010年中国手机出口量与增幅
2002-2010年中国手机出口额与增幅
2002-2010年中国手机出口量与ASP
2010年中国手机产量地域分布
2008-2012年NETBOOK、iPad、平板电脑出货量
2011-2012年全球主要品牌平板电脑出货量
2010-2011年主要内存厂商DRAM和NAND技术制程的发展
2003-2010年DRAM产品演进
2005-2015年内存市场规模及增长率
2005-2015年内存市场规模
eMMC与普通NAND chip 比较
2002-2011年DRAM产业资本投资
2011年全球DRAM晶圆投入
2007-2012年DRAM晶圆厂数量
2000-2011年DRAM晶圆厂建设及关闭数量
主要DRAM厂商的季度运营利润率
2000-2012年DRAM出货量增速
DRAM fab model
DRAM bit shipment model
DRAM revenue model
DRMA应用容量（分应用领域）
2005-2015F PC出货量(分产品)）
2010 年DRAM 报价及供需状况
2011年6月 DRAM合约价格
2010年6月-2011年6月DDR3 2Gb 现货报价
2006-2012年标准型内存平均搭载容量及增长率
2005-2012年DRAM市场规模及增长率
2005-2015年DRAM市场规模（分应用领域）
DRAM厂商10Q3 及11Q2 营收及市场份额
2005-2012年NOR市场规模及增长率
全球NOR Flash 厂商市场份额及排名
1Q11-2Q11NAND Flash报价
2005-2012年NAND市场规模及增长率
2008-2015年NAND 应用单位出货量
2008-2015年NAND平均负载（分应用领域）
2008-2015年NAND市场需求（分应用领域）
2008-2012年NAND需求市场（分应用行业）
2004-2015 NAND Flash 投资支出
2000-2011年NAND晶圆厂建设及关闭数量
NAND fab model
NAND bit shipment model
NAND 应用市场需求
NAND ASP model
各内存厂商NAND 收入
2008-2011F全球Flash厂商市场份额
NAND控制IC厂商一览
标准型DRAM、Mobile DRAM的比较
DDR、DDR2与DDR3的比较
Mobile DRAM 大多以MCP为主再与Chipset做堆叠
Mobile DRAM在DRAM市场中所占比重
2010年典型高端智能手机规格
2006-2012年智能手机存储器平均搭载容量及增长率
2006-2012年平板电脑存储器平均搭载容量及增长率
主要DRAM厂商推出的Mobile DRAM产品
主要DRAM厂Mobile DRAM规格
DRAM厂商Mobile DRAM市场份额
1Q09-4Q11全球Flash供需市场
2005-2012F 内嵌式Flash出货比例
2009-2014F手机用Flash出货量
e•MMC Share of Total Flash Market
e•MMC Density Trend
Mobile Handset Booting Architecture
各NAND 大厂eMMC品牌
2008-2010 SAMSUNG Sales and Profits
2008-2010 SAMSUNG Sales by Division
2008-2010 SAMSUNG Operating Profit by Division
2010Q1-2011Q4 SAMSUNG Memory Segment Sales by product
2010Q1-2011Q4 SAMSUNG DRAM shipments and asp per quarterly
2010Q1-2011Q4 SAMSUNG NAND shipments and asp per quarterly
2011年SAMSUNG电子DRAM和NAND收入中苹果公司贡献情况
SAMSUNG MCP技术路线
SAMSUNG Mobile DRAM and MCP Product
SAMSUNG eMMC Product
2007-2011年海力士营收及毛利率
2010Q1-2011Q4 HYNIX Memory Segment Sales by product
2010Q1-2011Q4 HYNIX DRAM shipments and asp per quarterly
2010Q1-2011Q4 HYNIX NAND shipments and asp per quarterly
Q1/2010-Q1/2011 Hynix sales by application
2010Q1-2011Q4 HYNIX DRAM Sales by node
2010Q1-2011Q4 HYNIX NAND Sales by node
HYNIX手机用MCP内存型号解码
FY2004-FY2010年Toshiba 销售收入及净利润
FY2010和FY2012东芝投资和研发支出
FY2007-FY2010年Toshiba 存储产品销售收入
NAND Flash Memory Product
Toshiba eMMC Product
FY2006-FY2010年尔必达营收及毛利率
FY2004-FY2010年尔必达DRAM产品营收
尔必达2011财年资本支出
FY2003-FY2010尔必达营收和净利润
2009-2010年尔必达营业收入（分地区）
尔必达业务架构
尔必达Mobile DDR/DDR2 DRAM Product
FY2004-FY2011 MICRON Sale and gross margin
FY2006-FY2010Micron 收入结构（分产品）
FY2006-FY2010Micron 收入结构（分应用领域）
Micron业务架构
FY2011Q1-Q3 Micron 营业收入（分业务）
Q3/FY09-Q3/FY11 MICRON R&D and SG&A Expenses
Q1/FY10-Q3/FY11 MICRON Cash Flow From Operations
2004-2010年Spansion收入与毛利率
2Q09-1Q11 Spansion收入与毛利率
2Q10-1Q11Spansion收入（分应用行业）
2Q10-1Q11Spansion收入（分地区）
2003-2011 Macronix sales and gross margin
06/2009-06/2011 Macronix sales per month
Q1/2009-Q1/2011 Macronix gross margin
Q1/2010、Q4/2010、Q1/2010 Macronix Quarterly Sales Breakdown by Products
Q1/2010、Q4/2010、Q1/2010 Macronix Quarterly Quantity Breakdown by Products
Q1/2010、Q4/2010、Q1/2010 Macronix Quarterly Sales Breakdown by Technology
Q1/2006-Q1/2011 Macronix 8” Equivalent Wafer Out & Utilization Rate
Q1/2006-Q1/2011 Macronix ROM quantity index
Q1/2009-Q1/2011 Macronix ROM Shipments by technology
Q1/2006-Q1/2011 Macronix NOR Flash quantity index
Q1/2009-Q1/2011 Macronix NOR Flash Shipments by technology
2011Q1 Macronix NOR Flash breakdown
2004-2011年华亚科技收入及毛利率
Q1/2010-Q1/2011 Inotera revenue and gross margin
Q1/2010-Q1/2011 Inotera wafer shipments
Q1/2010-Q1/2011 Inotera Quarterly Bit Shipments
2006-2010年Winbond 收入及毛利率
2Q09-1Q11年Winbond收入和毛利率
1Q09-1Q11年Winbond晶圆制程技术
2Q09-1Q11年Winbond营业收入结构（分产品）
1Q09-2Q11年华邦12吋晶圆产量（分产品）
1Q2011-1Q2012Winbond产品技术转移进程
2004-2010年Powerchip营业收入及毛利率
1Q2009-1Q2011年Powerchip营业收入及毛利率
1Q2011-4Q2011力晶DRAM和Flash研发进程
力晶DRAM产品参数
2004-2010年Promos 收入及毛利率
1Q2009-1Q2011年Promos 收入及毛利率
Promos MCP Product
2004-2010年 Nanya 营业收入及毛利率
1Q2009-1Q2011年Nanya营业收入及毛利率
2008-2012F南亚科技DRAM 销量及收入
2003-2011年南亚科技资本支出
2010年美光科技、尔必达DRAM制程成本比较
制程技术提升至50nm时节省的成本

Shipment of Mobile Phone Worldwide, 2007-2014
Quaterly Global Mobile Phone Shipment and Annual Growth Rate, Q1 2008-Q1 2011
Quaterly Shipment of CDMA and WCDMA Mobile Phone, 2007-2011
Global Mobile Phone Shipment by Brand, Q1 2010-Q1 2011
Market Shares of Major Mobile Phone Brands by Revenue, Q1 2009-Q3 2010
Shipment of Mobile Phone Worldwide by Brand, 2009-2010
Operating Margin of Global Top5 Mobile Phone Manufacturers, Q1 2009-Q4 2010
Shipment of Smart Phone Operating System Worldwide, Q3 2010
Market Share of Global Smart Phone Manufatcturers, Q1 2011
Market Share of Smart Phone Operating System, 2009-2012
Smart Phone Shipment of Global Mobile Phone Manufacturers, 2010-2011
Chinese Mobile Phone Export Volume and Growth Rate, 2000-2010
Chinese Mobile Phone Export Value and Growth Rate, 2002-2010
Chinese Mobile Phone Export Volume and ASP, 2002-2010
Chinese Mobile Phone Output by Region, 2010
Shipment of NETBOOK,iPad and Tablet PC, 2008-2012
Shipment of Global Major Tablet PC Brands, 2011-2012
DRAM and NAND Technology Development of Major Memory Vendors
Evolution of DRAM Products, 2003-2010
Memory Market Size and Growth Rate, 2005-2015
Memory Market Size, 2005-2015
Comparison between eMMC and Common NAND Chip
DRAM Industry Capital Investment, 2002-2011
Global DRAM Wafer Investment, 2011
DRAM Wafer Fab Quantity, 2007-2012
DRAM Wafer Fab Construction and Closed Numbers, 2000-2011
Quarterly Operating Margin of Main DRAM Vendors
DRAM Shipment Growth Rate, 2000-2012
DRAM Fab Model
Quaterly DRAM Bit Shipment of Major DRAM Vendors
DRAM Revenue Model
DRAM Consumption by Application
PC Shipment by Product, 2005-2015F
DRAM Quoted Price,Supply and Demand, 2010
DRAM Contract Price, June, 2011
DDR3 2Gb Spot Price,June 2010-June 2011
Average Carrying Capacity of Standard Memory and the Growth Rate, 2006-2012
DRAM Market Size and Growth Rate, 2005-2012
DRAM Market Size by Application, 2005-2015
Operating Revenue and Market Share of DRAM Vendors, Q3 2010-Q2 2011
NOR Market Size and Growth Rate, 2005-2012
Market Share of NOR Flash Manufacturers Worldwide
NAND Flash Quoted Price, Q1 2011-Q2 2011
NAND Market Size and Growth Rate , 2005-2012
NAND Shipment by Application, 2008-2015
NAND Average Carring Capacity by Application
NAND Market Demand by Application, 2008-2015
NAND Demand Market by Application,2008-2012
Investment Expenditure of NAND Flash , 2004-2015
NAND Fab Construction and Closed Numbers, 2000-2011
NAND Fab Model
NAND Bit Shipment Model
NAND Application Market Demand
NAND ASP Model
NAND Business Revenue of Major Memory Manufacturers
Market Share of Global Flash Memory Manufacturers, 2008-2011F
NAND Controll IC Manufacturers
Comparison Between Standard DRAM and Mobile DRAM
Comparison among DDR, DDR2 and DDR3
Proportion of Mobile DRAM in the DRAM Market by Revenue
Specifications of High-end Smart Phone, 2010
Average Carring Capacity and Growth Rate of Memory in Smart Phone
Average Carring Capacity and Growth Rate of Memory in Tablet PC
Mobile DRAM Products of Major DRAM Manufacturers
Specifications of Major Mobile DRAM Products
Market Share of Mobile DRAM Manufacturers
Global Flash Supply and Demand Market, Q1 2009-Q4 2011
Proportion of Embedded Flash Shippment, 2005-2012F
Shippment of Flash Used in Mobile Phone
eMMC Share of Total Flash Market
eMMC Density Trend
Mobile Handset Booting Architecture
eMMC Brands of Major NAND Manufacturers
SAMSUNG Sales and Profits,2008-2010
SAMSUNG Sales by Division, 2008-2010
SAMSUNG Operating Profit by Division, 2008-2010
SAMSUNG Memory Segment Sales by product, Q1 2010-Q4 2011
SAMSUNG DRAM Shipment and ASP, Q1 2010-Q4 2011
SAMSUNG NAND Shipment and ASP, Q1 2010-Q4 2011
DRAM and NAND Revenue Contribution of Apple to SAMSUNG Electronics, 2011
Technology Roadmap of SAMSUNG MCP
SAMSUNG Mobile DRAM and MCP Product
SAMSUNG eMMC Product
Operating Revenue and Gross Margin of Hynix, 2007-2011
HYNIX Memory Segment Sales by Product, Q1 2010-Q4 2011
HYNIX DRAM Shipment and ASP, Q1 2010-Q4 2011
HYNIX NAND Shipment and ASP, Q1 2010-Q4 2011
Hynix Sales by Application, Q1 2010-Q1 2011
HYNIX DRAM Sales by Node, Q1 2010-Q4 2011
HYNIX NAND Sales by Node, Q1 2010-Q4 2011
Model Decoding of HYNIX MCP Memory for Mobile Phone
Sales and Net Income of Toshiba,FY2004-FY2010
Investment and R&D Expenditure of Toshiba, FY2010-FY2011
Memory Product Sales of Toshiba,FY2007-FY2010
NAND Flash Memory Product
Toshiba eMMC Product
Operating Revenue and Gross Margin of Elpida, FY2006-FY2010
Operating Revenue of DRAM Product in Elpida, FY2004-FY2010
Capital Expenditure of Elpida, FY2011
Operating Revenue and Net Income of Elpida, FY2003-FY2010
Operating Revenue of Elpida by Region, 2009-2010
Business Structure of Elpida
Mobile DDR/DDR2 DRAM Product of Elpida
MICRON Sale and Gross Margin, FY2004-FY2011
Revenue Structure of Micron by Product, FY2006-FY2010
Revenue Structure of Micron by Application, FY2006-FY2010
Business of Structure of Micron
Operating Revenue of Micron by Business, FY2011Q1-Q3
MICRON R&D and SG&A Expenses, Q3 FY2009-Q3 FY2011
MICRON Cash Flow From Operations, Q1 FY2010-Q3 FY2011
Operating Revenue and Gross Margin of Spansion, 2004-2010
Quarterly Revenue and Gross Margin of Spansion, Q2 2009-Q1 2011
Revenue of Spansion by Application, Q2 2010-Q1 2011
Revenue of Spansion by Region, Q2 2010-Q1 2011
Macronix Sales and Gross Margin, 2003-2011
Macronix Sales Per Month, June 2009-June 2011
Macronix Gross Margin, Q1 2009-Q1 2011
Macronix Quarterly Sales Breakdown by Products, Q1 2010, Q4 2010, Q1 2010
Macronix Quarterly Quantity Breakdown by Products, Q1 2010, Q4 2010, Q1 2010
Macronix Quarterly Sales Breakdown by Technology, Q1 2010, Q4 2010, Q1 2010
Macronix 8” Equivalent Wafer Out & Utilization Rate, Q1 2006-Q1 2011
Macronix ROM Quantity Index, Q1 2006-Q1 2011
Macronix ROM Shipments by Technology, Q1 2009-Q1 2011
Macronix NOR Flash Quantity Index, Q1 2006-Q1 2011
Macronix NOR Flash Shipments by Technology, Q1 2009-Q1 2011
Macronix NOR Flash Breakdown, 2011Q1
Revenue and Gross Margin of Inotera, 2004-2011
Inotera Revenue and Gross Margin, Q1 2010-Q1 2011
Inotera Wafer Shipments, Q1 2010-Q1 2011
Inotera Quarterly Bit Shipments, Q1 2010-Q1 2011
Revenue and Gross Margin of Winbond, 2006-2010
Quarterly Revenue and Gross Margin of Winbond, Q2 2009-Q1 2011
Wafer Process Technology of Winbond, Q1 2009-Q1 2011
Operating Revenue Structure of Winbond by Product, Q2 2009-Q1 2011
12-inch Wafer Output of Winbond by Product, Q1 2009-Q2 2011
Production Technology Migration Process of Winbond, Q1 2011-Q1 2012
Operating Revenue and Gross Margin of Powerchip, 2004-2010
Quarterly Operating Revenue and Gross Margin of Powerchip,Q1 2009-Q1 2011
DRAM and Flash R&D Progression of Powership, Q1 2011-Q4 2011
DRAM Product Specifications of Powership
Revenue and Gross Margin of Promos, 2004-2010
Quarterly Revenue and Gross Margin of Promos, Q1 2009-Q1 2011
Promos MCP Product
Operating Revenue and Gross Margin of Nanya, 2004-2010
Quarterly Operating Revenue and Gross Margin of Nanya, Q1 2009-Q1 2011
DRAM Sales Volume and Revenue of Nanya, 2008-2012F
Capital Expenditure of Nanya, 2003-2011
Cost Comparison between Micron and Elpida by Process Technology, 2010
Cost Saving with 50nm Process Technology